Invention Grant
- Patent Title: Hinge and electronic device
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Application No.: US17576836Application Date: 2022-01-14
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Publication No.: US11886256B2Publication Date: 2024-01-30
- Inventor: Xinwei Liu
- Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Current Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Arch & Lake LLP
- Priority: CN 2110856086.8 2021.07.28
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A hinge and an electronic device are provided. The hinge includes a hinge body and a bendable assembly. The bendable assembly is in movable connection with one of opposite sides of the hinge body. The bendable assembly includes a first swing arm, a sliding member and a guide member. The first swing arm is in movable connection with the hinge body. A side wall of the sliding member is provided with a chute, and an end, close to the hinge body, of the chute is provided with a gap. The guide member is connected to the first swing arm and is configured to be engaged with or exited from the chute through the gap.
Public/Granted literature
- US20230035672A1 HINGE AND ELECTRONIC DEVICE Public/Granted day:2023-02-02
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