Invention Grant
- Patent Title: Hybrid heat sink for electronics cooling
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Application No.: US16784110Application Date: 2020-02-06
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Publication No.: US11886258B2Publication Date: 2024-01-30
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; H01L23/467 ; H01L23/473

Abstract:
Embodiments are disclosed of a hybrid heat sink. The hybrid heat sink includes a dry base and a wet base spaced apart from the dry base. The wet base including a fluid inlet and a fluid outlet. A plurality of air channels is formed between the dry base and the wet base; and a plurality of liquid channels are formed between the dry base and the wet base. The plurality of liquid channels are coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels are thermally coupled to the plurality of air channels. Other embodiments are disclosed and claimed.
Public/Granted literature
- US20210247822A1 HYBRID HEAT SINK FOR ELECTRONICS COOLING Public/Granted day:2021-08-12
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