Invention Grant
- Patent Title: Thermal load prediction method and apparatus, readable medium, and electronic device
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Application No.: US17058137Application Date: 2019-09-25
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Publication No.: US11887020B2Publication Date: 2024-01-30
- Inventor: Shengwei Liu , Xin Huang
- Applicant: ENNEW Technology Co., Ltd.
- Applicant Address: CN Langfang
- Assignee: ENNEW Technology Co., Ltd.
- Current Assignee: ENNEW Technology Co., Ltd.
- Current Assignee Address: CN Langfang
- Agency: Bayramoglu Law Offices LLC
- Priority: CN 1811113972.6 2018.09.25
- International Application: PCT/CN2019/107928 2019.09.25
- International Announcement: WO2020/063686A 2020.04.02
- Date entered country: 2020-11-24
- Main IPC: G06N7/01
- IPC: G06N7/01 ; G06F30/27 ; G06F119/08 ; G06F111/08

Abstract:
A thermal load prediction method and apparatus. The method includes configuring multiple prediction states and corresponding error thresholds and forming a prediction model. The prediction model predicting first thermal load magnitudes respectively corresponding to multiple testing time periods, wherein a target steam user uses boiler steam in the multiple testing time periods. Determining, according to the first thermal load magnitudes, relative prediction errors respectively corresponding to the multiple testing time periods Forming a state transition probability matrix according to the relative prediction errors, and determining a state probability of each prediction state in each future time period of future time periods according to the state transition probability matrix. The prediction model predicting second thermal load magnitudes respectively corresponding to the future time periods; and for the each future time period, determining a thermal load range corresponding to the each future time period according to the second thermal load magnitudes.
Public/Granted literature
- US20210304045A1 THERMAL LOAD PREDICTION METHOD AND APPARATUS, READABLE MEDIUM, AND ELECTRONIC DEVICE Public/Granted day:2021-09-30
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