An electronic component evaluation method of evaluating a state of an electronic component includes acquiring reference point information, with respect to at least one terminal, reference point information including at least one of position information and first height information of a plurality of corresponding reference points on the terminal from imaging data obtained by image-capturing the electronic component including a component body and a plurality of terminals attached to the component body, and determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information.