Invention Grant
- Patent Title: Laser diode, thermally assisted magnetic head, head gimbal assembly, hard disk drive and method of manufacturing a head gimbal assembly
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Application No.: US17980771Application Date: 2022-11-04
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Publication No.: US11887638B1Publication Date: 2024-01-30
- Inventor: Ryo Hosoi , Seiichi Takayama , Kang Gao , Yasuhiro Konakawa , Yasutoshi Fujita , Ryuji Fujii
- Applicant: SAE Magnetics (H.K.) Ltd.
- Applicant Address: CN Hong Kong
- Assignee: SAE MAGNETICS (H.K.) LTD.
- Current Assignee: SAE MAGNETICS (H.K.) LTD.
- Current Assignee Address: CN Hong Kong
- Agency: NIXON & VANDERHYE, P.C.
- Main IPC: G11B7/127
- IPC: G11B7/127 ; G11B5/00
Abstract:
The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.
Information query
IPC分类:
