A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.