Invention Grant
- Patent Title: Laminated electronic component
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Application No.: US17178160Application Date: 2021-02-17
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Publication No.: US11887764B2Publication Date: 2024-01-30
- Inventor: Yutaka Noguchi , Takeshi Kobayashi , Makoto Yamamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 16187242 2016.09.26
- The original application number of the division: US15711388 2017.09.21
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F17/04 ; H01F27/29 ; H01L23/522 ; H05K3/46

Abstract:
A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.
Public/Granted literature
- US20210174997A1 LAMINATED ELECTRONIC COMPONENT Public/Granted day:2021-06-10
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