Invention Grant
- Patent Title: Coil component
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Application No.: US16942002Application Date: 2020-07-29
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Publication No.: US11887768B2Publication Date: 2024-01-30
- Inventor: Hyung Ho Kim , Hyeon Yu Song , Jae Kwang Kim , Byung Kug Cho
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN. LEWIS & BOCKIUS LLP
- Priority: KR 20200006393 2020.01.17
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/255 ; H01F27/28 ; H01F27/29 ; H01F17/04 ; H01F27/32

Abstract:
A coil component includes a wound coil having a winding portion, including at least one turn, and a lead-out portion extending from an end portion of the winding portion to form a separation space, together with the winding portion, the wound coil being formed of a metal wire having a surface on which an insulating coating portion is disposed, a body embedding the wound coil therein and including magnetic powder particles and an insulating resin, and an insulating layer disposed on at least one of a surface of the winding portion and a surface of the lead-out portion forming the separation space.
Public/Granted literature
- US11848139B2 Coil component Public/Granted day:2023-12-19
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