Invention Grant
- Patent Title: Coil component
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Application No.: US17085209Application Date: 2020-10-30
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Publication No.: US11887770B2Publication Date: 2024-01-30
- Inventor: Hyeon Yu Song , Hyung Ho Kim , Sung Jin Park , Sang Ho Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200002379 2020.01.08
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F41/02 ; H01F41/04 ; H01F27/255

Abstract:
A coil component includes a wound coil having a winding portion, having at least one turn, and a lead-out portion extending from an end portion of the winding portion to provide a separation space together with the winding portion and a body including an insulating resin and magnetic powder particles and embedding the wound coil therein. The body has a low-density portion disposed in the separation space and having magnetic powder particle density lower than average magnetic powder particle density of an entirety of the body.
Public/Granted literature
- US20210210272A1 COIL COMPONENT Public/Granted day:2021-07-08
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