Invention Grant
- Patent Title: Electronic component and method for manufacturing electronic component
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Application No.: US17374365Application Date: 2021-07-13
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Publication No.: US11887771B2Publication Date: 2024-01-30
- Inventor: Shinichi Sakamoto , Zhigang Cheng , Fernando Chan Mock , Mitsugu Kawarai
- Applicant: SUMIDA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMIDA CORPORATION
- Current Assignee: SUMIDA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN 1310109345.6 2013.03.29 CN 1410050474.7 2014.02.13
- The original application number of the division: US15364749 2016.11.30
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F41/02 ; H01F41/04 ; H01F27/30 ; H01F41/061 ; H01F27/24

Abstract:
An electronic component comprises: a magnetic core having a flat base and a core, the flat base having a top, a bottom, and first and second opposite sides, the core is on the top; a winding having an edgewise coil including a wound flat wire and the core, the winding having two non-wound flat wires extending therefrom; and a magnetic exterior body covering the core and the edgewise coil. The two non-wound flat wires extend along the top, the first side, the bottom and then the second side, and the two non-wound flat wires are non-adhesively positioned around the flat base. The two non-wound flat wires on the bottom are externally exposed electrodes. The second side inclines towards the core. The two ends of the two non-wound flat wires are embedded into the magnetic exterior body to fix the two non-wound flat wires to the magnetic exterior body.
Public/Granted literature
- US20210343469A1 Electronic Component And Method For Manufacturing Electronic Component Public/Granted day:2021-11-04
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