Invention Grant
- Patent Title: Multilayer capacitor and board having the same
-
Application No.: US17496657Application Date: 2021-10-07
-
Publication No.: US11887790B2Publication Date: 2024-01-30
- Inventor: Su Hyoung Lee , Seung Jun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200149552 2020.11.10
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232 ; H01G2/06 ; H01G4/008 ; H01G4/12

Abstract:
A multilayer capacitor includes: a capacitor body including dielectric layers and first and second internal electrodes, and having first to six surfaces; first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively, and having roughnesses on surfaces thereof; a first external electrode disposed on the third surface of the capacitor body and parts of the first and second side portions and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface of the capacitor body and parts of the first and second side portions and connected to the second internal electrodes.
Public/Granted literature
- US20220148813A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2022-05-12
Information query