Invention Grant
- Patent Title: Semiconductor processing chambers for deposition and etch
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Application No.: US17014177Application Date: 2020-09-08
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Publication No.: US11887811B2Publication Date: 2024-01-30
- Inventor: Khokan Chandra Paul , Ravikumar Patil
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/683 ; C23C16/458 ; C23C16/509 ; H01L21/687

Abstract:
Exemplary semiconductor substrate supports may include a pedestal having a shaft and a platen. The semiconductor substrate supports may include a cover plate. The cover plate may be coupled with the platen along a first surface of the cover plate. The cover plate may define a recessed channel in a second surface of the cover plate opposite the first surface. The semiconductor substrate supports may include a puck coupled with the second surface of the cover plate. The puck may incorporate an electrode. The puck may define a plurality of apertures extending vertically through the puck to fluidly access the recessed channel defined in the cover plate.
Public/Granted literature
- US20220076919A1 SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH Public/Granted day:2022-03-10
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