Invention Grant
- Patent Title: Plasma processing apparatus
-
Application No.: US17513711Application Date: 2021-10-28
-
Publication No.: US11887816B2Publication Date: 2024-01-30
- Inventor: Kazushi Kaneko , Yohei Ishida
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 20180598 2020.10.28 JP 21143191 2021.09.02
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
There is provided a plasma processing apparatus. The apparatus comprises: a chamber body; and a power supply unit configured to output power for exciting a gas supplied to an inside of the chamber body. The power supply unit supplies, as power having a center frequency, a bandwidth, and a carrier pitch respectively corresponding to a set frequency, a set bandwidth, and a set carrier pitch that are indicated by a controller, power which is pulse-modulated so as to be a pulse frequency, a duty ratio, a high level, and a low level respectively corresponding to a set pulse frequency, a set duty ratio, a high-level set power, and a low-level set power indicated by the controller, and in which a pulse on time determined by the set pulse frequency and the set duty ratio is longer than a power fluctuation cycle of the power having the bandwidth.
Public/Granted literature
- US20220130643A1 PLASMA PROCESSING APPARATUS Public/Granted day:2022-04-28
Information query