Invention Grant
- Patent Title: Edge ring and etching apparatus
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Application No.: US17367948Application Date: 2021-07-06
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Publication No.: US11887822B2Publication Date: 2024-01-30
- Inventor: Toshifumi Ishida , Yusuke Saitoh
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 21089366 2021.05.27
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
An edge ring includes a ramp surface of which a height decreases from an outer edge-side portion toward an inner edge-side portion. The edge ring is configured to satisfy the relation of T2/T1>T4/T3. Where, T1 is a thickness of the edge ring, before plasma treatment, at a first position on the ramp surface of the inner edge-side portion, and T2 is a thickness of the edge ring, before plasma treatment, at a second position on the ramp surface of the outer edge-side portion. T3 is a thickness of the edge ring, after plasma treatment, at the first position, and T4 is a thickness of the edge ring, after plasma treatment, at the second position.
Public/Granted literature
- US20220013338A1 EDGE RING AND ETCHING APPARATUS Public/Granted day:2022-01-13
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