Invention Grant
- Patent Title: System and method for manufacturing a semiconductor package structure
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Application No.: US17086189Application Date: 2020-10-30
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Publication No.: US11887865B2Publication Date: 2024-01-30
- Inventor: Chenghan She
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; B29C43/34 ; B29C43/08 ; H01L21/67 ; B29C43/18 ; B29L31/34 ; B29K105/00
Abstract:
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
Public/Granted literature
- US20220139726A1 SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2022-05-05
Information query
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