Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16942018Application Date: 2020-07-29
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Publication No.: US11887871B2Publication Date: 2024-01-30
- Inventor: Kazushige Sano , Yuichi Tanaka , Yoshihiro Kai
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 19140207 2019.07.30
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66
Abstract:
A substrate processing apparatus includes a processing tub configured to store therein a processing liquid in which multiple substrates are to be immersed; multiple liquid supplies each of which includes a supply line through which the processing liquid is supplied to an inside of a water tank of the processing tub and a heating device configured to heat the processing liquid at a portion of the supply line; and multiple in-tank temperature sensors configured to measure a temperature of the processing liquid at multiple positions within the water tank of the processing tub.
Public/Granted literature
- US20210035825A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-02-04
Information query
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