Invention Grant
- Patent Title: In-situ apparatus for semiconductor process module
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Application No.: US17365612Application Date: 2021-07-01
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Publication No.: US11887879B2Publication Date: 2024-01-30
- Inventor: Yogananda Sarode Vishwanath , Steven E. Babayan , Stephen Prouty , Andreas Schmid
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: PATTERSON + SHERIDAN, LLP
- Agent Chad M. Dougherty
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C23C16/458 ; H01J37/32 ; H01L21/677 ; H01L21/683

Abstract:
Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.
Public/Granted literature
- US20210351063A1 IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE Public/Granted day:2021-11-11
Information query
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