Invention Grant
- Patent Title: Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor device
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Application No.: US17729183Application Date: 2022-04-26
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Publication No.: US11887915B2Publication Date: 2024-01-30
- Inventor: Masafumi Suzuhara
- Applicant: Amkor Technology Japan, Inc.
- Applicant Address: JP Usuki
- Assignee: Amkor Technology Japan, Inc.
- Current Assignee: Amkor Technology Japan, Inc.
- Current Assignee Address: JP Usuki
- Agent Kevin B. Jackson
- Priority: JP 16044341 2016.03.08
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/50 ; H01L21/288 ; H01L21/52 ; H01L21/76 ; H01L21/78 ; H01L23/28
Abstract:
A semiconductor package includes a die pad; a plurality of external connection terminals located around the die pad; a semiconductor chip located on a top surface of the die pad and electrically connected with the plurality of external connection terminals; and a sealing member covering the die pad, the plurality of external connection terminals and the semiconductor chip and exposing an outer terminal of each of the plurality of external connection terminals. A side surface of the outer terminal of each of the plurality of external connection terminals includes a first area, and the first area is plated.
Public/Granted literature
- US20220254704A1 SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2022-08-11
Information query
IPC分类:
