Reduction in susceptibility of analog integrated circuits and sensors to radio frequency interference
Abstract:
An apparatus comprises a ground plane (2), an integrated circuit chip (1) disposed on the ground plane (2), the integrated circuit chip (1) comprising one or more electrically conductive layers (10) encircling a periphery of the integrated circuit chip (1), and a plurality of bondwires (9) electrically coupling the one or more electrically conductive layers (10) to the ground plane (2).
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