In some embodiments, a radio-frequency device can be manufactured by a method that includes forming or providing a substrate, fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side, and mounting the front side of the flip chip die on the substrate. The method can further include implementing a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.