A package structure for a power supply module, can include: a die and a capacitive element that are separated from each other and arranged on different horizontal planes with different heights along a vertical direction of the package structure; connection structures that connect to the die and to the capacitive element; where a current loop comprising at least two parallel current paths on different horizontal planes with different heights along the vertical direction of the package structure is formed; and where the current loop passes through the die, the capacitive element, and the connection structures, and directions of currents of the two parallel current paths are at least partially opposite to each other in order to decrease electromagnetic interference.