- Patent Title: Semiconductor device with isolation and/or protection structures
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Application No.: US17039043Application Date: 2020-09-30
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Publication No.: US11887945B2Publication Date: 2024-01-30
- Inventor: Lei Zhao , Fabian Radulescu
- Applicant: Wolfspeed, Inc.
- Applicant Address: US NC Durham
- Assignee: WOLFSPEED, INC.
- Current Assignee: WOLFSPEED, INC.
- Current Assignee Address: US NC Durham
- Agency: COATS & BENNETT, PLLC
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/528 ; H01L23/552 ; H01L27/06 ; H01L29/06 ; H01L29/20 ; H01L29/778 ; H01L29/78 ; H03F3/21 ; H03F1/02 ; H01L23/48

Abstract:
The present disclosure relates to a semiconductor device with isolation and/or protection structures. A semiconductor device can include a substrate, a first transistor and a second transistor, wherein the first transistor and the second transistor are formed on the substrate, and an isolation structure formed on the substrate. The isolation structure can be formed on the substrate between the first transistor and the second transistor. The isolation structure can be configured to isolate the first transistor and the second transistor.
Public/Granted literature
- US20220102294A1 Semiconductor Device With Isolation And/Or Protection Structures Public/Granted day:2022-03-31
Information query
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