Invention Grant
- Patent Title: Semiconductor device, semiconductor arrangement and method for producing the same
-
Application No.: US17687797Application Date: 2022-03-07
-
Publication No.: US11887961B2Publication Date: 2024-01-30
- Inventor: Paul Frank , Thomas Heinelt , Oliver Schilling , Sven Schmidbauer , Frank Wagner
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP 161250 2021.03.08
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor device includes a semiconductor wafer or a single semiconductor chip or die, and a layer stack. The layer stack comprises a first layer comprising NiSi, and a second layer comprising NiV, wherein the second layer is arranged between the first layer and the semiconductor wafer or single semiconductor chip or die.
Public/Granted literature
- US20220285307A1 Semiconductor Device, Semiconductor Arrangement and Method for Producing the Same Public/Granted day:2022-09-08
Information query
IPC分类:
