Invention Grant
- Patent Title: Method of operating microelectronic package
-
Application No.: US17591561Application Date: 2022-02-02
-
Publication No.: US11887974B2Publication Date: 2024-01-30
- Inventor: Wenliang Chen , Lin Ma , Alessandro Minzoni
- Applicant: AP Memory Technology Corp.
- Applicant Address: TW Zhubei
- Assignee: AP Memory Technology Corp.
- Current Assignee: AP Memory Technology Corp.
- Current Assignee Address: TW Zhubei
- Agency: Chen Yoshimura LLP
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/18 ; H01L23/00
Abstract:
A method of operating a microelectronic package includes a processing device stacking vertically with at least one memory device. The method includes a step of: reading data stored in a plurality of memory cells of a plurality of memory units of the memory device, with the processing device, with a plurality of signal channels each of which is dedicated to transmit signals from the processing device to one of the memory units and vice versa.
Public/Granted literature
- US20220157800A1 METHOD OF OPERATING MICROELECTRONIC PACKAGE Public/Granted day:2022-05-19
Information query
IPC分类:
