Invention Grant
- Patent Title: Method for manufacturing array substrate
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Application No.: US17368847Application Date: 2021-07-07
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Publication No.: US11887990B2Publication Date: 2024-01-30
- Inventor: Beizhou Huang
- Applicant: HKC Corporation Limited
- Applicant Address: CN Guangdong
- Assignee: HKC Corporation Limited
- Current Assignee: HKC Corporation Limited
- Current Assignee Address: CN Shenzhen
- Priority: CN 1810779922.5 2018.07.16
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1339 ; G02F1/1362 ; G02F1/1335 ; H01L27/146 ; G02F1/1343 ; G02F1/1333 ; G02F1/11

Abstract:
Disclosed is a method for manufacturing array substrate, including steps of: providing a substrate, forming a plurality of active switches on the substrate; forming a color filter layer on the substrate; forming a spacer unit layer on the color filter layer; and forming an electrode layer on the color filter layer and the spacer unit layer, including forming a first electrode layer in a display region of the substrate, and forming a second electrode layer in a non-display region of the substrate; where the first electrode layer is a pixel electrode layer, the spacer unit layer includes a spacer unit, and the first electrode layer includes a first electrode region overlying the spacer unit, where a vertical projection of the spacer unit along a thickness direction of the substrate has an overlap portion with a vertical projection of the first electrode layer along the thickness direction of the substrate.
Public/Granted literature
- US20210335833A1 METHOD FOR MANUFACTURING ARRAY SUBSTRATE Public/Granted day:2021-10-28
Information query
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