Invention Grant
- Patent Title: Thin-film transistors
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Application No.: US17424911Application Date: 2019-05-13
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Publication No.: US11887993B2Publication Date: 2024-01-30
- Inventor: Hsing-Hung Hsieh , Kuan-Ting Wu , Super Liao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh, P.C.
- International Application: PCT/US2019/031974 2019.05.13
- International Announcement: WO2020/231398A 2020.11.19
- Date entered country: 2021-07-22
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H10K59/12 ; H01L29/66

Abstract:
The present disclosure is drawn to thin-film transistors, electronic displays that include thin-film transistors, and methods of making thin-film transistors. In one example, a thin-film transistor can include a nonconductive substrate, a semiconductor layer on the nonconductive substrate, a source electrode adjacent a first side of the semiconductor layer and partially overlapping a first peripheral portion of the semiconductor layer, a drain electrode adjacent a second side of the semiconductor layer and partially overlapping a second peripheral portion of the semiconductor layer, an etch stop layer on the semiconductor layer, a gat insulator layer on the etch stop layer, and a gate electrode on the gate insulator layer. The source electrode and the drain electrode do not overlap the etch stop layer.
Public/Granted literature
- US20220109009A1 THIN-FILM TRANSISTORS Public/Granted day:2022-04-07
Information query
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