Invention Grant
- Patent Title: Imaging device, manufacturing method thereof, and electronic apparatus
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Application No.: US16972657Application Date: 2019-06-13
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Publication No.: US11888006B2Publication Date: 2024-01-30
- Inventor: Yuki Miyanami , Atsushi Okuyama
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 18114537 2018.06.15 JP 19108072 2019.06.10
- International Application: PCT/JP2019/023429 2019.06.13
- International Announcement: WO2019/240207A 2019.12.19
- Date entered country: 2020-12-07
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An imaging device having a superior light-shielding property for a charge-holding section is provided. The imaging device includes: an Si {111} substrate extending along a horizontal plane; a photoelectric conversion section provided in the Si {111} substrate and generating charges corresponding to a light reception amount by photoelectric conversion; a charge-holding section provided in the Si {111} substrate and holding charges transferred from the photoelectric conversion section; and a light-shielding section including a horizontal light-shielding part positioned between the photoelectric conversion section and the charge-holding section in a thickness direction and extending along the horizontal plane and a vertical light-shielding part orthogonal thereto. The horizontal light-shielding section includes a first plane along a first crystal plane of the Si {111} substrate of a plane index {111} orthogonal to the thickness direction, and a second plane along a second crystal plane of the Si {111} substrate inclined to the thickness direction.
Public/Granted literature
- US20210249456A1 IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS Public/Granted day:2021-08-12
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