Invention Grant
- Patent Title: Image sensor formed in sequential 3D technology
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Application No.: US17017363Application Date: 2020-09-10
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Publication No.: US11888007B2Publication Date: 2024-01-30
- Inventor: Lina Kadura , François Andrieu , Perrine Batude , Christophe Licitra
- Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- Applicant Address: FR Paris
- Assignee: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- Current Assignee: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- Current Assignee Address: FR Paris
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: FR 10294 2019.09.18
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor including a plurality of pixels, each pixel including a photodetector coupled to a control circuit, the photodetector being formed inside and on top of a first semiconductor substrate, and the control circuit including at least one first MOS transistor formed inside and on top of a second semiconductor substrate arranged on the first substrate, the sensor being intended to be illuminated on the side of the surface of the first substrate opposite to the second substrate, the sensor further comprising a shield arranged between the first and second substrates and extending over substantially the entire surface of the sensor, said shield including at least one electrically-conductive layer.
Public/Granted literature
- US20210082983A1 IMAGE SENSOR FORMED IN SEQUENTIAL 3D TECHNOLOGY Public/Granted day:2021-03-18
Information query
IPC分类: