Invention Grant
- Patent Title: Electronic detection module for testing micro chips
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Application No.: US16992838Application Date: 2020-08-13
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Publication No.: US11888011B2Publication Date: 2024-01-30
- Inventor: Hsien-Te Chen
- Applicant: ULTRA DISPLAY TECHNOLOGY CORP.
- Applicant Address: TW Taipei
- Assignee: ULTRA DISPLAY TECHNOLOGY CORP.
- Current Assignee: ULTRA DISPLAY TECHNOLOGY CORP.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 8129149 2019.08.15
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113 ; H01L27/146

Abstract:
An electronic detection interface comprises a substrate structure and a plurality of detection units in array. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units.
Public/Granted literature
- US20210050381A1 ELECTRONIC DETECTION INTERFACE AND ELECTRONIC DETECTION MODULE USING THE SAME Public/Granted day:2021-02-18
Information query
IPC分类: