Invention Grant
- Patent Title: Compound semiconductor and method for manufacturing same
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Application No.: US16617212Application Date: 2018-06-01
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Publication No.: US11888033B2Publication Date: 2024-01-30
- Inventor: Hiroshi Fujioka , Kohei Ueno
- Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Applicant Address: JP Kawaguchi
- Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee Address: JP Kawaguchi
- Agency: ROSSI, KIMMS & McDOWELL LLP
- Priority: WO TJP2017020513 2017.06.01 JP 18041338 2018.03.07
- International Application: PCT/JP2018/021122 2018.06.01
- International Announcement: WO2018/221711A 2018.12.06
- Date entered country: 2019-11-26
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/02 ; H01L29/207 ; C23C14/06 ; C23C14/34

Abstract:
A nitride compound semiconductor having a low resistivity that is conventionally difficult to be manufactured is provided. Since the nitride compound semiconductor exhibits a high electron mobility, a high-performance semiconductor device may be configured. The present invention may provide, at a high productivity, a group 13 nitride semiconductor of an n-type conductivity that may be formed as a film on a substrate having a large area size and has a mobility of 70 to 140 cm2/(V·s) by a pulsed sputtering method performed in a process atmosphere at room temperature to 700° C.
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