Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US17385985Application Date: 2021-07-27
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Publication No.: US11888035B2Publication Date: 2024-01-30
- Inventor: Yasuyuki Kawada , Aki Takigawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 20147099 2020.09.01
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/26 ; H01L29/78 ; H01L21/66

Abstract:
The silicon carbide semiconductor device includes: a silicon carbide layer; a silicon dioxide layer provided above the silicon carbide layer and containing nitrogen; and a transition region arranged between the silicon carbide layer and the silicon dioxide layer, and containing carbon, oxygen, and nitrogen, wherein the maximum nitrogen concentration in the transition region is 1.0×1020 cm−3 or higher. The maximum nitrogen concentration in the transition region is five or more times higher than the maximum nitrogen concentration in the silicon dioxide layer.
Public/Granted literature
- US20220069089A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2022-03-03
Information query
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