Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US17987351Application Date: 2022-11-15
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Publication No.: US11888040B2Publication Date: 2024-01-30
- Inventor: Toshiki Hikosaka , Hiroshi Ono , Jumpei Tajima , Masahiko Kuraguchi , Shinya Nunoue
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 19076921 2019.04.15
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/739 ; H01L29/778

Abstract:
According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode, a first semiconductor layer, a second semiconductor layer, and a first insulating layer. A position of the third electrode in a first direction is between a position of the first electrode in the first direction and a position of the second electrode in the first direction. The first semiconductor layer includes Alx1Ga1-x1N and includes a first partial region, a second partial region, and a third partial region. The second semiconductor layer includes Alx2Ga1-x2N. A portion of the second semiconductor layer is between the third partial region and the third electrode in the second direction. The first insulating layer includes a first insulating region. The first insulating region is between the third electrode and the portion of the second semiconductor layer in the second direction.
Public/Granted literature
- US20230078716A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-03-16
Information query
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