Invention Grant
- Patent Title: Gallium nitride-on-silicon devices
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Application No.: US17346333Application Date: 2021-06-14
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Publication No.: US11888055B2Publication Date: 2024-01-30
- Inventor: Jun-De Jin , Chan-Hong Chern
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Merchant & Gould P.C.
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/02 ; H01L21/762 ; H01L29/20 ; H01L29/66

Abstract:
A gallium nitride-on-silicon structure is disclosed in which the two-dimensional electron gas (2DEG) layer is a discontinuous layer that includes at least two 2DEG segments. Each 2DEG segment is separated from another 2DEG segment by a gap. The 2DEG layer can be depleted by a p-doped gallium nitride layer that is disposed over a portion of an aluminum gallium nitride layer. Additionally or alternatively, a trench may be formed in the structure through the 2DEG layer to produce a gap in the 2DEG layer. An electrical component is positioned over at least a portion of a gap.
Public/Granted literature
- US20210305419A1 GALLIUM NITRIDE-ON-SILICON DEVICES Public/Granted day:2021-09-30
Information query
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