Invention Grant
- Patent Title: Silicon carbide MOS-gated semiconductor device
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Application No.: US17468582Application Date: 2021-09-07
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Publication No.: US11888056B2Publication Date: 2024-01-30
- Inventor: Cheng-Tyng Yen
- Applicant: Fast SiC Semiconductor Incorporated
- Applicant Address: TW Hsinchu
- Assignee: FAST SIC SEMICONDUCTOR INCORPORATED
- Current Assignee: FAST SIC SEMICONDUCTOR INCORPORATED
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/06 ; H01L29/16

Abstract:
A silicon carbide MOS-gated semiconductor device comprises a silicon carbide substrate, a drift layer, a first doped region, a second doped region, a plurality of third doped regions, a gate insulating layer, a gate electrode, an interlayer dielectric layer, and a metal layer. The gate electrode comprises a gate bus region and an active region. The active region comprises a plurality of gate electrode openings. The two adjacent gate electrode openings have a minimum width (Wg) which is satisfied the following formula:
Wg>Wjfet+2×Lch+2×Lx
Lch represents a channel length of channel regions, Wjfet represents a minimum width of JFET regions, and Lx represents a minimum overlapping length between the gate electrode and the second doped region.
Wg>Wjfet+2×Lch+2×Lx
Lch represents a channel length of channel regions, Wjfet represents a minimum width of JFET regions, and Lx represents a minimum overlapping length between the gate electrode and the second doped region.
Public/Granted literature
- US20230071655A1 SILICON CARBIDE MOS-GATED SEMICONDUCTOR DEVICE Public/Granted day:2023-03-09
Information query
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