A method for manufacturing LED devices is provided. The method comprises forming an epitaxial layer on a starter substrate, the epitaxial layer having a first surface that interfaces with the starter substrate and a second surface opposite to the first surface; establishing an adhesive bond between the second surface of the epitaxial layer and a carrier substrate having a pre-determined light transmittance; etching away the starter substrate; etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies on a third surface of the epitaxial layer opposite to the second surface; establishing one or more conductive bonds between selected one or more LED dies, from the plurality of LED dies, and a backplane; weakening the adhesive bond between the second surface of the epitaxial layer and the carrier substrate; and moving the carrier substrate away from the backplane.