Invention Grant
- Patent Title: Antenna package
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Application No.: US17408982Application Date: 2021-08-23
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Publication No.: US11888208B2Publication Date: 2024-01-30
- Inventor: Deborah Cogoni
- Applicant: STMicroelectronics (Alps) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Alps) SAS
- Current Assignee: STMicroelectronics (Alps) SAS
- Current Assignee Address: FR Grenoble
- Agency: Crowe & Dunlevy
- Priority: FR 08676 2020.08.25
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/12 ; H01Q1/38

Abstract:
An electronic device includes a first layer with an antenna and a second metal layer that extends over the entire first layer. The second metal layer includes at least one laterally-closed cavity that is located vertically above the antenna. The cavity is filled, at least in part, by a resin material. A first plate supporting a second metal plate extends over the cavity with the second metal plate positioned vertically above the antenna. The first metal plate may be supported by a ledge within the cavity. Alternatively, the second metal plate is embedded in the resin filling the cavity, with the second metal plate positioned vertically above the antenna.
Public/Granted literature
- US20220069430A1 ANTENNA PACKAGE Public/Granted day:2022-03-03
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