Invention Grant
- Patent Title: Bottom-emitting emitter array with a bottom side metal layer
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Application No.: US17247659Application Date: 2020-12-18
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Publication No.: US11888293B2Publication Date: 2024-01-30
- Inventor: Ajit Vijay Barve , Eric R. Hegblom
- Applicant: Lumentum Operations LLC
- Applicant Address: US CA San Jose
- Assignee: Lumentum Operations LLC
- Current Assignee: Lumentum Operations LLC
- Current Assignee Address: US CA San Jose
- Agency: Harrity & Harrity, LLP
- Main IPC: H01S5/42
- IPC: H01S5/42 ; H01S5/183 ; H01S5/042

Abstract:
In some implementations, an emitter array may include a substrate, an epitaxial structure on the substrate, a plurality of bottom-emitting emitters defined in the epitaxial structure, a first electrical contact positioned at a top side of the epitaxial structure, a second electrical contact positioned at the top side of the epitaxial structure, and a metal layer disposed on a bottom side of the substrate. The metal layer may be electrically connected to the second electrical contact. The metal layer may include one or more openings for light emission of the plurality of bottom-emitting emitters.
Public/Granted literature
- US20220131346A1 BOTTOM-EMITTING EMITTER ARRAY WITH A BOTTOM SIDE METAL LAYER Public/Granted day:2022-04-28
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