Invention Grant
- Patent Title: Acoustic wave device, acoustic wave filter, and composite filter device
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Application No.: US17183431Application Date: 2021-02-24
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Publication No.: US11888461B2Publication Date: 2024-01-30
- Inventor: Ryo Nakagawa , Hideki Iwamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: KEATING & BENNETT, LLP
- Priority: JP 18168265 2018.09.07
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/25

Abstract:
An acoustic wave device includes a silicon oxide film, a lithium tantalate film, an IDT electrode, and a protection film that are laminated on a support substrate made of silicon. A wavelength normalized film thickness of a lithium tantalate film is denoted by TLT, an Euler angle is θLT, a wavelength normalized film thickness of the silicon oxide film is TS, a wavelength normalized film thickness of the IDT electrode in terms of aluminum thickness is TE, a wavelength normalized film thickness of a protection film is TP, a propagation direction in the support substrate is ψSi, and a wavelength normalized film thickness of the support substrate is TSi. Values of TLT, θLT, TS, TE, TP, and ψSi are set such that Ih corresponding to an intensity of a response of a spurious response represented by Formula (1) is greater than about −2.4 in a spurious response.
Public/Granted literature
- US20210194455A1 ACOUSTIC WAVE DEVICE, ACOUSTIC WAVE FILTER, AND COMPOSITE FILTER DEVICE Public/Granted day:2021-06-24
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