Invention Grant
- Patent Title: Method for manufacturing capacitor, capacitor array structure and semiconductor memory
-
Application No.: US17594922Application Date: 2021-06-17
-
Publication No.: US11889676B2Publication Date: 2024-01-30
- Inventor: Kangshu Zhan , Jun Xia
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2010778901.9 2020.08.05
- International Application: PCT/CN2021/100735 2021.06.17
- International Announcement: WO2022/028122A 2022.02.10
- Date entered country: 2021-11-03
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
The present disclosure discloses a method for manufacturing a capacitor, a capacitor array structure and a semiconductor memory. The method for manufacturing a capacitor includes: providing an underlayer; forming a substrate to be etched on the underlayer; enabling a wafer to include a central area and an edge area; forming a first hard mask layer having a first pattern in the central area on the substrate to be etched; using the first hard mask layer as a mask to etch the substrate to be etched, to form capacitor holes; depositing a lower electrode layer; and sequentially forming a capacitor dielectric layer and an upper electrode layer.
Public/Granted literature
- US20230139419A1 METHOD FOR MANUFACTURING CAPACITOR, CAPACITOR ARRAY STRUCTURE AND SEMICONDUCTOR MEMORY Public/Granted day:2023-05-04
Information query