Invention Grant
- Patent Title: Ultrasound transducer assembly
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Application No.: US16933822Application Date: 2020-07-20
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Publication No.: US11890140B2Publication Date: 2024-02-06
- Inventor: Wei Li , Gregg Frey , Simon Hsu
- Applicant: FUJIFILM SONOSITE, INC.
- Applicant Address: US WA Bothell
- Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee Address: US WA Bothell
- Agency: Womble Bond Dickinson (US) LLP
- The original application number of the division: US15256029 2016.09.02
- Main IPC: B06B1/06
- IPC: B06B1/06 ; A61B8/00 ; H10N30/072 ; H10N30/088 ; H10N30/20 ; G01N29/24

Abstract:
Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.
Public/Granted literature
- US20200345328A1 ULTRASOUND TRANSDUCER ASSEMBLY Public/Granted day:2020-11-05
Information query
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