Invention Grant
- Patent Title: Web forming apparatus and molded body manufacturing apparatus
-
Application No.: US17807150Application Date: 2022-06-16
-
Publication No.: US11890789B2Publication Date: 2024-02-06
- Inventor: Hisashi Koike , Satomi Yoshioka , Akio Ito
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP 21101394 2021.06.18
- Main IPC: B29C43/34
- IPC: B29C43/34 ; B29C43/24

Abstract:
A web forming apparatus includes a drum portion and a second web forming unit. The drum portion has an accommodating chamber capable of accommodating fragments, and accommodating powder supplied from a first supplying unit. The second web forming unit forms a second web by letting a mixture containing the fragments and the powder falling from the drum portion accumulate. The first supplying unit includes a storing chamber for storing the powder and an outlet portion provided below the storing chamber. The powder goes out of the storing chamber via the outlet portion. The drum portion has meshes formed in a net demarcating the accommodating chamber. The powder is able to pass through the meshes. The outlet portion is provided vertically over the net of the drum portion.
Public/Granted literature
- US20220402175A1 WEB FORMING APPARATUS AND MOLDED BODY MANUFACTURING APPARATUS Public/Granted day:2022-12-22
Information query