Invention Grant
- Patent Title: Mold clamping apparatus provided with forceful mold opening mechanism
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Application No.: US16924111Application Date: 2020-07-08
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Publication No.: US11890796B2Publication Date: 2024-02-06
- Inventor: Hozumi Yoda , Atsushi Murata , Satoshi Hoshino
- Applicant: NISSEI PLASTIC INDUSTRIAL CO., LTD.
- Applicant Address: JP Nagano-ken
- Assignee: NISSEI PLASTIC INDUSTRIAL CO., LTD.
- Current Assignee: NISSEI PLASTIC INDUSTRIAL CO., LTD.
- Current Assignee Address: JP Nagano-ken
- Agency: ADAMS & WILKS
- Priority: JP 19165833 2019.09.12
- Main IPC: B29C45/68
- IPC: B29C45/68 ; B29C33/24 ; B29C45/76

Abstract:
In a mold clamping apparatus, a mold clamping mechanism is provided with a half nut, and a tie bar is provided with circumferential groove configured to meshed with the teeth of the half nut. A strong-force mold opening mechanism that opens molds at an initial stage of mold opening extends across a space separating a movable platen and the mold clamping mechanism and is connected to the movable platen and the mold clamping mechanism. The strong-force mold opening mechanism is set so as to have greater axial force and shorter stroke than those of a mold opening and closing mechanism. A control unit controls opening and closing of the half nut, controls the strong-force mold opening mechanism and controls the position of the half nut in such a way that the half nut is synchronized with the circumferential groove by the strong-force mold opening mechanism.
Public/Granted literature
- US20210078228A1 MOLD CLAMPING APPARATUS PROVIDED WITH FORCEFUL MOLD OPENING MECHANISM Public/Granted day:2021-03-18
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