Invention Grant
- Patent Title: Method for manufacturing three-dimensional structure, and three-dimensional structure
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Application No.: US17541330Application Date: 2021-12-03
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Publication No.: US11890820B2Publication Date: 2024-02-06
- Inventor: Koji Shinoda
- Applicant: HOSIDEN CORPORATION
- Applicant Address: JP Yao
- Assignee: HOSIDEN CORPORATION
- Current Assignee: HOSIDEN CORPORATION
- Current Assignee Address: JP Yao
- Agency: Kilyk & Bowersox, P.L.L.C.
- Priority: JP 20210253 2020.12.18
- Main IPC: B29C65/64
- IPC: B29C65/64 ; B29C45/00 ; B29C45/14 ; B60R13/00 ; B60R13/04 ; B29L31/30

Abstract:
A method for manufacturing a three-dimensional structure including: preparing a first structure including a fixing face; fixing a plastic layer to the fixing face of the first structure; preparing a conductive wire; and operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer.
Public/Granted literature
- US20220194022A1 METHOD FOR MANUFACTURING THREE-DIMENSIONAL STRUCTURE, AND THREE-DIMENSIONAL STRUCTURE Public/Granted day:2022-06-23
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