Invention Grant
- Patent Title: Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor
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Application No.: US17795376Application Date: 2021-01-19
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Publication No.: US11890853B2Publication Date: 2024-02-06
- Inventor: Yoshihiro Yoneda , Toshihiro Hosoi , Tetsuro Sato
- Applicant: MITSUI MINING & SMELTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 20011799 2020.01.28
- International Application: PCT/JP2021/001625 2021.01.19
- International Announcement: WO2021/153339A 2021.08.05
- Date entered country: 2022-07-26
- Main IPC: B32B7/025
- IPC: B32B7/025 ; B32B15/08 ; B32B15/20 ; B32B27/28 ; B32B27/38

Abstract:
There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.
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