Invention Grant
- Patent Title: Thermosetting epoxy resin composition having low curing temperature and good storage stability
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Application No.: US17287067Application Date: 2019-12-23
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Publication No.: US11891507B2Publication Date: 2024-02-06
- Inventor: Noah Munzinger , Dominique Gallo
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP 150161 2019.01.03
- International Application: PCT/EP2019/086914 2019.12.23
- International Announcement: WO2020/141130A 2020.07.09
- Date entered country: 2021-04-20
- Main IPC: C08L63/04
- IPC: C08L63/04 ; C08G59/40 ; C09J7/35 ; C08F136/06 ; C08G18/75 ; C08G59/24 ; C08G59/46 ; C08L71/02 ; C08L75/04 ; C09J163/04
Abstract:
A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.
Public/Granted literature
- US20210355316A1 THERMOSETTING EPOXY RESIN COMPOSITION HAVING LOW CURING TEMPERATURE AND GOOD STORAGE STABILITY Public/Granted day:2021-11-18
Information query
