Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US17208306Application Date: 2021-03-22
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Publication No.: US11891697B2Publication Date: 2024-02-06
- Inventor: Naofumi Ohashi , Takashi Yahata , Yukinori Aburatani , Shun Matsui
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Kokusai Electric Corporation
- Current Assignee: Kokusai Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JP 20104646 2020.06.17
- Main IPC: C23C16/458
- IPC: C23C16/458 ; H01L21/02 ; C23C16/34 ; C23C16/40

Abstract:
There is provided a technique that includes: a process chamber in which a substrate is processed; a gas supplier configured to supply a gas into the process chamber; at least one substrate mounting table disposed in the process chamber and including a substrate mounting surface on which the substrate is mounted; and an arm configured to transfer the substrate to the substrate mounting surface while supporting a lower surface of the substrate, wherein the arm includes a support that includes an inclination and is configured to support the substrate.
Public/Granted literature
- US20210395887A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-12-23
Information query
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