A holding apparatus for applying an electrolytic plating treatment to a planar workpiece, and the holding apparatus can reduce an amount of plating that is deposited on an edge part of the planar workpiece. The holding apparatus for applying the electrolytic plating treatment to the planar workpiece has a rear member and a front member facing the rear member and having an opening part. The planar workpiece is disposed between the rear member and the front member. The front member has a plurality of electrodes and a plurality of first insulating parts. The plurality of electrodes and the plurality of first insulating parts cover the edge part of the planar workpiece in a width direction of the planar workpiece.