Invention Grant
- Patent Title: Cooling device
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Application No.: US17567926Application Date: 2022-01-04
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Publication No.: US11892246B2Publication Date: 2024-02-06
- Inventor: Kento Ohga , Hideo Kubo , Kenji Sasabe , Masahide Kodama , Atsushi Endo , Keita Hirai , Nobumitsu Aoki , Takashi Urai
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Intellectual Property Center
- Priority: JP 21042929 2021.03.16
- Main IPC: F28F1/02
- IPC: F28F1/02 ; H01L23/427 ; H01L23/40

Abstract:
A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
Public/Granted literature
- US20220299273A1 COOLING DEVICE Public/Granted day:2022-09-22
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