Invention Grant
- Patent Title: Haptic feedback system
-
Application No.: US17459237Application Date: 2021-08-27
-
Publication No.: US11892703B2Publication Date: 2024-02-06
- Inventor: Yi-Ho Chen , Ying-Jen Wang , Ya-Hsiu Wu
- Applicant: TDK TAIWAN CORP.
- Applicant Address: TW Taoyuan
- Assignee: TDK TAIWAN CORP.
- Current Assignee: TDK TAIWAN CORP.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G02B7/04
- IPC: G02B7/04 ; G02B7/02 ; G02B27/64 ; G02B13/00 ; G02B26/08 ; G02B7/00 ; G01L1/16 ; G06F3/01 ; H03K17/96 ; G03B5/00 ; G03B17/12 ; H02K41/035 ; G02B7/09 ; G02B27/00 ; H04N23/55 ; H04N23/68 ; H10N30/30 ; G02B7/182
Abstract:
A haptic feedback system is provided, including a sensing unit, a haptic feedback module, and a circuit assembly. The sensing unit is configured to detect contact with an object. The haptic feedback module is configured to transfer the contact force to the sensing unit. The circuit assembly is electrically connected to the sensing unit and the haptic feedback module.
Public/Granted literature
- US20220066562A1 HAPTIC FEEDBACK SYSTEM Public/Granted day:2022-03-03
Information query
