Invention Grant
- Patent Title: Interconnect circuit
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Application No.: US17870715Application Date: 2022-07-21
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Publication No.: US11892968B2Publication Date: 2024-02-06
- Inventor: Paul James Metzgen
- Applicant: Silicon Tailor Limited
- Applicant Address: GB London
- Assignee: Silicon Tailor Limited
- Current Assignee: Silicon Tailor Limited
- Current Assignee Address: GB Putney
- Agency: Fish & Richardson P.C.
- Priority: GB 10616 2021.07.23
- Main IPC: G06F15/173
- IPC: G06F15/173

Abstract:
A circuit having multiple inputs and multiple outputs the circuit being for switching signals received at any of the inputs to any of the outputs, the circuit comprising: a first switch matrix, the first switch matrix being capable of directing signals received at the inputs of the circuit to multiple first intermediate ports; a second switch matrix, the second switch matrix being capable of directing signals received at multiple second intermediate ports to multiple third intermediate ports, the number of the second intermediate ports being less than the number of the inputs of the circuit; one or more primary bypass links, each primary bypass link being capable of coupling one or more of the first intermediate ports to a respective one or more of the outputs of the circuit independently of the second switch matrix; a first redirection layer, the first redirection layer being capable of, for each first intermediate port, directing a signal received at that first intermediate port to a primary bypass link or to a second intermediate port; and a second redirection layer, the second redirection layer being capable of directing signals received at each of the primary bypass links to a respective one or more outputs of the circuit, and directing signals received at each of the third intermediate ports to a respective one or more outputs of the circuit.
Public/Granted literature
- US20230023021A1 INTERCONNECT CIRCUIT Public/Granted day:2023-01-26
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